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SMD PACKAGES
 
PART NO. 1112
TIPS FOR EASY PICK SMD DE-SOLDERING WITH VACUUM PICK-UP
 
SO/TSOP Packages
Dimension(mm)
PART NO  
X
Y
3015 SOIC 8 05.25 05.75
3016 SOIC 14, 16 09.5 11.5
3017 SOICL 20, 20J 09.5 14.0
3018 SOICL 20, 24J 09.5 16.5
3019 SOICL 28 09.5 19.0
3020 SOJ 32 12.75 21.5
3021 SOJ 40 12.75 27.0
3022 TSOP 20, 24 15.5 07.5
3023 TSOP 28, 32 19.5 09.5
3024 TSOP 40 19.5 11.0
3025 TSOP 48, 56 19.5 15.5
3026 TSOPW 20, 24 09.5 19.0
3027 TSOPW 40, 44 11.5 21.0
 
PQFP/BQFP Packages
Dimension(mm)
PART NO  
X
Y
3115 PQFP   16.0 22.0
3116 PQFP   17.5 23.5
3117 PQFP 068 15.7 15.7
3118 PQFP 080 19.5 14.8
3119 PQFP 084 18.5 18.5
3120 PQFP 100 17.5 17.5
3121 PQFP 132 26.3 26.3
3122 PQFP 144 30.0 30.0
3123 PQFP 160 32.0 32.0
3124 BQFP 084 14.0 14.0
3125 BQFP 100 17.5 17.5
3126 BQFP 132 22.5 22.5
3127 BQFP 164 28.0 28.0
3128 BQFP 196 32.5 32.5
3129 BQFP 244 40.0 40.0
 
PICC/LCCC Packages
Dimension(mm)
PART NO
X
Y
3215 PLCC 18 09.0 06.0
3216 PLCC 20 07.0 07.0
3217 PLCC 28 10.0 10.0
3218 PLCC 32 12.5 10.0
3219 PLCC/LCCC 44 15.0 15.0
3220 PLCC/LCCC 52 17.5 17.5
3221 PLCC/LCCC 68 22.0 22.0
3222 PLCC/LCCC 84 29.5 29.5
3223 PLCC/LCCC 100 34.0 34.0
3224 PLCC/LCCC 124 38.0 38.0
 
CHIP
COMPONENTS
DIMENSIONS
(MM)
PART NO
X
Y
3225 EPS 1 2.5 2.15
3226 EPS 2 3.9 2.15
3227 EPS 3 6.0 3.0
Note: Wide Range of Tips Available Other Than Above Packages

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